Desktop Contact Soldering

Benchtop soldering robots are compact, table-mounted machines designed for precise and repeatable soldering in small-scale production or prototyping. These robots typically feature programmable X, Y, Z axes, and a soldering iron or laser tool for automated operations. Ideal for PCB assembly, they enhance consistency, minimize operator error, and reduce production time, making them perfect for electronics manufacturing, R&D labs, and low- to medium-volume workflows.

Soldering modules from Japan Unix, are highly customizable components designed for integration into automated systems. These modules include advanced soldering tools, controllers, and feeders optimized for precision and flexibility. Ideal for robotic integration or standalone use, they support various soldering methods such as contact, laser, and induction, catering to diverse industries including electronics, automotive, and medical device manufacturing.

Contact Soldering Process

Pre-Heat: In both processes, the temperature is gradually raised to prevent thermal shock to sensitive components. Flux is applied to clean the surfaces and promote better bonding.

Heating: For contact soldering, a heated iron tip is used to transfer heat to the joint, melting the solder. In laser soldering, a focused laser beam is activated to rapidly heat the solder and components, ensuring precise control over the temperature to avoid damage.

Post-Heat: Solder is applied to the joint in both methods. In contact soldering, the molten solder fills gaps and forms a solid connection. In laser soldering, the solder melts and flows into place, creating a strong bond without overheating surrounding areas.

Cooling: The iron tip or laser is removed, and the joint is allowed to cool, solidifying the solder and ensuring a reliable electrical and mechanical connection.

Both techniques ensure a secure solder joint but differ in their heat application—contact soldering uses a heated iron, while laser soldering uses a focused beam of light.

Pre-Heat: In both processes, the temperature is gradually raised to prevent thermal shock to sensitive components. Flux is applied to clean the surfaces and promote better bonding.

Heating: For contact soldering, a heated iron tip is used to transfer heat to the joint, melting the solder. In laser soldering, a focused laser beam is activated to rapidly heat the solder and components, ensuring precise control over the temperature to avoid damage.

Post-Heat: Solder is applied to the joint in both methods. In contact soldering, the molten solder fills gaps and forms a solid connection. In laser soldering, the solder melts and flows into place, creating a strong bond without overheating surrounding areas.

Cooling: The iron tip or laser is removed, and the joint is allowed to cool, solidifying the solder and ensuring a reliable electrical and mechanical connection.

Pre-Heat: Before soldering, it's important to gradually warm up the components to prevent thermal shock. With a soldering iron, the tip heats the area slowly, and flux is applied to clean the surfaces for better adhesion.

Heating: This is where the real action happens. In contact soldering, the heated iron tip touches the joint, transferring heat directly to melt the solder.

Post-Heat: Once the joint is hot enough, the solder melts and flows into place. With a soldering iron, the heat keeps the solder molten until it fills the gaps and bonds properly.

Cooling: After the solder is applied, it needs to cool and solidify. In contact soldering, removing the iron allows the solder to naturally harden into a strong connection.