Developed by Fancort Industries, Inc.
3D VISION INSPECTION
General
Introducing Fancort's Veri-Spec 3D, a high-resolution/precision 3D vision inspection system for SMT gullwing lead-forming. The Veri-Spec 3D uses a fully featured HMI where new parts can be introduced in seconds. Options include data logging to internal and/or external databases and seamless integration into the robotic Fancort Tinning Cell and SmartFlex.
Parameterized Inspection
The SMT Vision inspection station will be able to take Flat Packs or Quad Flat Packs and automatically inspect the leads based on a set of user-entered parameters. This means entirely new packages can be introduced to the inspection system and be ready to inspect within seconds.
The 3D vision inspection system can inspect parts based on user-defined tolerances. Recipes can save package dimensions and tolerance settings, allowing part changes to be one click away.
Customizable Experience: Choose what data to view and save.
User Interface
User interface can display simplified “GO/NO-GO” indications or be set to display advanced measurement viewing and visualizations.
Data Logging
All process data can be logged locally and/or remotely to a SQL server. Logging options can be chosen to include only the data relevant to the customer.
- MEASUREMENT VALUES
- PROCESS SETTINGS AND VALUES
- 3D POINT CLOUD DATA
- PART NUMBERS AND CUSTOM DATA
Process Control
Viewable control charts for tracking process stability under the influence of a range of factors.
High-Precision Line Scanner / Laser Scanner
High-Precision Line Scanner / Laser Scanner
The scanner has a minimum resolution of 4 μm and a repeatability of 0.4 μm (height) / 0.5 μm (width).
Lead Processing Inspection Systems
Each lead is individually processed to reduce noise issues on highly reflective surfaces. Noise is eliminated without compromising scan data.
3D laser scanner vision system settings are also adjustable and can be saved for each lead material and package.
Point data above shown before individual-lead post-processing
Photo of scanned packages
Lead Processing Inspection Systems
Each lead is individually processed to reduce noise issues on highly reflective surfaces. Noise is eliminated without compromising scan data.
Laser scanner settings are also adjustable and can be saved for each lead material and package.
Left: Post-Processed Lead / Right: (Induced) worst-case noisy scan output
Specs. and Options
Measurement Options
Each lead is automatically processed and measured individually.
Profile Angles
Measure the lead angles relative to the body.
Toe Angle of 5.079 degrees
J Height of 0.9634 mm
Profile Widths
Measure the lead widths.
Lead width of 0.1925mm
Profile Bend Radii
Measure the radius of each bend.
Bend radius of 0.0118”
Advanced Lead Measurements
System utilizes computation of finite difference of lead profiles to find bends. Finding bends allows the dynamic application of best-fit circles to each bend for radius measurement, and allows for partial lead-length measurements.
Lead Profile, 1st Derivative, 2nd Derivative
XY Angle
Measure individual lead’s XY angle relative to the body.
The plane of a single lead (green) is shown intersecting with the plane of the chip body (orange). The top right shows the intersection angle is 88.6/91.39 degrees.
Downloads
For more information, click on the button or contact:
