Overview

PHM2-2 PULSE HEATED MACHINE
Rotary Turntable Model

The PHM2-2P Pulse Heated Machine (Rotary Turntable Model) is a specialized industrial device used for applications that require precision heating and bonding. Here’s a breakdown of its key features and typical uses:

Key Features

Pulse Heating Technology: Utilizes a pulse heating mechanism that allows for precise control of the heating process. This method provides rapid heating and cooling cycles, enhancing the efficiency and accuracy of bonding processes.

Rotary Turntable Design: Equipped with a rotary turntable which enables continuous or semi-continuous operation. This design is beneficial for high-volume production as it allows multiple parts to be processed in a sequential manner, reducing downtime between cycles.

Precision Control: Offers precise temperature control, typically with integrated feedback systems to maintain the desired temperature profile throughout the process. This is crucial for applications that require consistent thermal performance.

Application Versatility: Suitable for a wide range of applications including electronics assembly, thermocompression bonding, soldering, and other processes where controlled heating is critical.

Automation Compatibility: Can be integrated into automated production lines, enhancing throughput and consistency. The turntable model is particularly useful in automated environments due to its ability to handle multiple parts with minimal manual intervention.

Typical Applications

Electronics Assembly: Used for attaching components such as connectors, flex circuits, and other small parts to PCBs (Printed Circuit Boards).

Thermocompression Bonding: Employed in processes where materials are bonded using heat and pressure. This is common in semiconductor packaging and other high-precision electronic applications.

Soldering: Facilitates soldering of delicate components where precise control over the temperature and heating duration is necessary to avoid damage to the parts.

Medical Device Manufacturing: Utilized in the production of medical devices that require precise and reliable bonding of components.

Benefits

Increased Efficiency: The rotary turntable allows for continuous processing, which can significantly increase production efficiency.

Enhanced Quality Control: Precise temperature control and rapid heating/cooling cycles help ensure consistent quality in the bonding process.

Flexibility: Capable of handling a variety of materials and bonding processes, making it versatile for different industrial applications.

The PHM2-2P Pulse Heated Machine (Rotary Turntable Model) is a high-precision, versatile tool designed for industrial applications requiring meticulous control over heating and bonding processes. Its rotary turntable design and pulse heating technology make it particularly suitable for high-volume, automated production environments, ensuring both efficiency and high-quality outcomes.

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Specifications:
Temperature Range Force Range - 50 to 500°C
Time Period - 30 N to 500 N
Thermode stroke - 1 to 99 seconds 50mm
Thermode working area - 400mm²
fixture working area - 200 x 150mm (x 2)
Power Supply - AC 110/220V 50/60Hz
Working Pressure - 0.5-0.6Mpa
Weight - 125KG
Dimensions - 620x770x792mm

Overview

The ACFB-A1S All-in-One ACF Bonder is a specialized machine used in the electronics manufacturing industry, particularly for bonding Anisotropic Conductive Film (ACF). ACF is a material that allows for the creation of electrical connections and is commonly used in applications like LCD displays, touch panels, and flexible circuits.

Key features and functions of the ACFB-A1S All-in-One ACF Bonder typically include:

All-in-One Design: Combines multiple functions into a single machine, including ACF tape cutting, positioning, bonding, and inspection, which increases efficiency and reduces the need for multiple machines.

High Precision: Designed for precise alignment and bonding, ensuring reliable electrical connections and high-quality output.

User-Friendly Interface: Often equipped with an easy-to-use control system, which may include a touch screen interface for setting parameters and monitoring the bonding process.

Temperature and Pressure Control: Provides accurate control over the bonding temperature and pressure, essential for achieving optimal bonding results.

Versatility: Capable of handling various types of ACF materials and accommodating different sizes and shapes of substrates.

Automatic Functions: Includes automation features like automatic tape feeding, cutting, and alignment to enhance productivity and consistency.

Quality Assurance: Equipped with inspection systems to ensure the quality of the bonds, reducing the likelihood of defects in the final product.

The ACFB-A1S All-in-One ACF Bonder is an essential tool in the production of modern electronic devices, contributing to the efficiency and reliability of the manufacturing process.

Specifications

Maximum ACF pressing width mm: 5
Range of temp °C: 0~500
Rate of temp. raising Nos: 8
Tolerance of temp. pressing ±°C: 2
Area of press mm²: 400
Air pressure KPa: 60~600
Resolution of programmable KPa: 1
Force accuracy: ±2
Time of pressing sec: 0~99
Flow rate of Vacuum L/min: 24
Power supply VAC: 220/110
Standard working Area (WxD) mm: 150x200
Max. Working Area (WxD) mm: 200x260
Positioning: (sight/magnifying lens)
Weight kg: 110