PHM2-2 PULSE HEATED MACHINE
ROTARY TURNTABLE MODEL

The PHM2-2 Pulse Heated Machine with Rotary Turntable is a high-precision, versatile tool tailored for industrial applications that demand meticulous control over heating and bonding processes. Featuring a rotary turntable and pulse heating technology, it is ideal for high-volume, automated production environments, delivering both efficiency and exceptional quality.

KEY FEATURES

Pulse Heating Technology: Employs pulse heating for precise control of heating cycles. This technology provides rapid heat-up and cool-down, optimizing both efficiency and accuracy in bonding processes.

Rotary Turntable Design: Equipped with a rotary turntable for continuous or semi-continuous operation, perfect for high-volume production. This design allows sequential processing of multiple parts, minimizing downtime between cycles.

Precision Control: Offers highly accurate temperature regulation through integrated feedback systems, ensuring the desired thermal profile is maintained throughout the process, which is essential for applications requiring consistent thermal performance.

Versatile Applications: Suitable for a variety of processes, including electronics assembly, thermocompression bonding, soldering, and any other tasks requiring controlled heating.

Automation Ready: Easily integrates into automated production lines to boost throughput and consistency. The turntable design is particularly
advantageous for handling multiple parts with minimal manual intervention in automated environments.

TYPICAL APPLICATIONS

Electronics Assembly: Ideal for attaching components like connectors, flex circuits, and small parts to PCBs (Printed Circuit Boards).

Thermocompression Bonding: Perfect for bonding materials using heat and pressure, commonly used in semiconductor packaging and other
high-precision electronics applications.

Soldering: Provides precise control over temperature and heating duration, safeguarding delicate components from damage during soldering.

Medical Device Manufacturing: Utilized in producing medical devices where accurate and reliable bonding of components is critical.

ACFB-A1S
ALL-IN-ONE ACF BONDER

The ACFB-A1S All-In-One ACF Bonder is a specialized machine designed for electronics manufacturing, particularly for bonding Anisotropic Conductive Film (ACF). ACF is crucial for creating electrical connections in applications such as LCD displays, touch panels, and flexible circuits.

KEY FEATURES AND FUNCTIONS

All-in-One Design: Integrates multiple functions into a single machine, including ACF tape cutting, positioning, bonding, and inspection. This consolidated design boosts efficiency and eliminates the need for multiple machines.

High Precision: Engineered for precise alignment and bonding, ensuring reliable electrical connections and high-quality output with every application.

User-Friendly Interface: Equipped with an intuitive control system, often featuring a touch screen interface for easy parameter setting and real-time process monitoring.

Temperature and Pressure Control: Delivers precise control over bonding temperature and pressure, ensuring optimal bonding performance and high-quality results.

Versatility: Handles a wide range of ACF materials and accommodates various sizes and shapes of substrates, making it adaptable to diverse production needs.

Automation Features: Includes automatic tape feeding, cutting, and alignment to increase productivity and ensure consistency across all production cycles.

Quality Assurance: Equipped with advanced inspection systems to guarantee bond quality, reducing defects and ensuring a reliable final product.

The ACFB-A1S All-In-One ACF Bonder is an essential tool for the modern electronics manufacturing process, enhancing both efficiency and reliability in production.