LEAD RECONDITIONING EQUIPMENT

General

Rework Damaged Leads

Damage to fine pitch components is a common industry problem, and with current parts shortages, can become a critical production issue. Typical Military and Aerospace components are fabricated with Ceramic and have Kovar leads to survive extreme environments, are very expensive, and sometimes not easily replaceable.

As pick and place machines become more accurate in their inspection cycle, the parts must be within JEDEC specifications or will be rejected. Lead reconditioning of these "rejected" fine pitch components use to be an expensive process.

There are machines on the market that cost well over $150,000 that need to be retooled completely, for an additional $50K for every different component. Fancort's MLCS-3 System changes this for a fraction of the cost. The leads on all SMT components have a memory from the initial lead forming, and fine pitch components are easy to deform, sometimes during test or handling.

You, also, risk permanent damage to the components by overworking the leads during repair, if not done in a machine that accurately and precisely controls the process. If you are doing hand rework now, or your pick and place system rejects some of your formed components, we have a solution: MLCS-3 System.

The System is made to work on Ceramic and Plastic components. The MLCS-3 is user friendly, easy to operate and easy to understand. Setup takes about 30 minutes or less for a new component and change over to a component you have already processed about half that.

The key to the system is that the settings are easily set, recorded and the lead reconditioning is done under an HD camera. Fancort, also, supplies an F-1B/1X-RC Reforming Tool that is the first critical step in the process to get the components back to the original form when they were initially fabricated.

A unique tooling system to reform coplanarity on two and four sided SMDs. The system processes components one side at a time to precise coplanar dimensions, normally within the standard JEDEC specifications of .004". The tool can be adjusted to change the standoff height, the shoulder dimension, adapt to various lead material thickness and heel radius for components up to 2.5" in length. Additional inexpensive forming sets can be purchased to change any of these package dimensions.

The lead reconditioning machine is a unique system that can correct for skew, splay and minor coplanarity defects. The unit can, also, alter the foot position relative to the PCB for improved soldering. The MLCS can bring most two and four sided SMD components that have been reformed first (using the F-1B/1X-RC) back within JEDEC requirements. The system processes components one side at a time to precise dimensions, while the operator watches the progress on an HD monitoring system. The System can handle the most common components in the industry up to 352 leads and any pitch up to .5mm. Additional inexpensive nests and combs can be purchased as your future requirements change.

The system will handle SMT components from a very small flat pack or quad pack with a body size of about 6.35mm to the very large FPGA with a maximum body size of 50.8mm as long as the proper nest and comb for the MLCS and proper insert and pressure pad is used for both systems.