Pre-Heat | In both processes, the temperature is gradually raised to prevent thermal shock to sensitive components. Flux is applied to clean the surfaces and promote better bonding.
Heating | For contact soldering, a heated iron tip is used to transfer heat to the joint, melting the solder. In laser soldering, a focused laser beam is activated to rapidly heat the solder and components, ensuring precise control over the temperature to avoid damage.
Post-Heat | Solder is applied to the joint in both methods. In contact soldering, the molten solder fills gaps and forms a solid connection. In laser soldering, the solder melts and flows into place, creating a strong bond without overheating surrounding areas.
Cooling | The iron tip or laser is removed, and the joint is allowed to cool, solidifying the solder and ensuring a reliable electrical and mechanical connection.
Both techniques ensure a secure solder joint but differ in their heat application, contact soldering uses a heated iron, while laser soldering uses a focused beam of light.