PCB LASER DEPANELING

Trusted by the Aerospace & Defense Industry for over 47 years

Fancort offers a High-End Flexible PCB Laser Cutting Machine

Adopted with high-performance UV laser cold light source, high-precision CCD image positioning technology and self-developed visual laser control software, this equipment perfectly implements contour cutting, drilling and marking of FPC and PCB, and precision processing of composite membrane.

USA Supported

Equipment tested in USA

5 STAR RATED

Serving the industry since 1973

AEROSPACE QUALITY

Trusted by the aerospace & defense industry

Worldwide Shipping

We ship our equipments globally

SHOP OUR LASER DEPANELING PRODUCTS

PCB LASER CUTTING EQUIPMENT

PROCESS OVERVIEW

Laser Cutting System is widely used in modern PCB/FPC industry.

This laser cutting machine uses short wavelength laser (Ultra-violet) beam to scan the surface of the PCB, then the high-energy ultraviolet beam is in direct-affection to the surface of the molecular bonds of the flexible material.

UV laser processing is "cold processing", the "cold" processing the target area of PCB/FPC with smooth edges and leave minimal carbonation on the board.

SYSTEM INTRODUCTION

This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser generator.

This equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing.

With sophisticated two-axis table and closed loop control module, it ensures fast cutting while maintaining micron magnitude of precision with modern technology of position sensors and CCD image capture application.

Suitable Processing Materials

Flexible circuit boards, rigid circuit boards, rigid-flex circuit board sub-board processing.
Rigid, flexible circuit board sub-board processing component is installed.
Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an acrylic film, a polyimide coating film.
Thickness of 0.6mm or less precision ceramic cutting, dicing; variety of cutting the base material (silicon, ceramics, glass, etc.)
Etching precision molding various functional films, an organic film and other precision cutting.
Polymer: polyimide, polycarbonate, polymethyl methacrylate, FR-4, PP, etc.
Functional film: gold, silver, copper, titanium, aluminum, chromium, ITO, silicon, poly-crystalline silicon, amorphous silicon and a metal oxide.
Brittle material: monocrystalline silicon, polycrystalline silicon, ceramic and sapphire.

Technical Specs

Laser	Laser Source	355 nm UV
	Power	15 W
	Coaxial Video Positioning	B/W CCD
	Scan Range	60×60 mm
	Focused Spot Diameter	<20 um (UV Laser)
	Auto Focus System	Z axis auto focus
	Focus Control Precision	0.01 mm
Main structure configuration	X-Y Working Platform	Ac servo motor
	Base	High-precision granite platform
	Travel Range	300×400 (Optional size range)
	Platform Motion Resolution	0.5 um
	Overall Control System	IPC
	Assisted Control System	Mitsubishi PLC
	CCD Lighting Source	620 nm red light LED
	External Auxiliary Device	Negative pressure air blower, dusting system
Processing Characteristics	Processing Size Range	360×460 mm
	Min Linear Width	20 um
	Stitching Accuracy	±5 um
	Scanning Head Correction Accuracy	±5 um
	X-Y Table Correction Accuracy	±4 um
	CCD Matching Accuracy	7 μm
	Processing Accuracy	±4 micrometers
	Processing Thickness	<1 mm
Environmental Conditions	Power Supply	AC 220V±10%,50HZ,1P,3KVA
	Fixture	Customize to the needs
	Document Format	DXF, GBR, etc.
	Environment Temperature	15-30°(constant temperature for high precision)
	Environment Humidity	<50%
	Weight	1500KG
	Mainframe Size	1350mm(W) ×1050mm(D) ×1950(H)

We can customize to fit your needs, for more information, click on the button or contact:

Nor Omar
nor@fancort.com
(888) 326-2678

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