About Fancort™ Robotic Dispensing
Overview
Fancort offers a complete array of highly engineered robotic dispensing solutions. Every system is designed, built, supported and tested by our team of engineers and technicians.
These are some of the most common problems solved with our Robotic Dispensing Systems:
High labor and operating costs
Variation in the results of the dispensing application from different operators.
Liquid Spill
Scrap generation
Low production quality
Rework due bad dispensing
Lack of qualified labor force
No control in material usage
No traceability in the process
Excessive liquid waste on the workstation
Production Line downtime
Fancort's Process
Connect
Our expertise aligns with your dispensing process.
Investigate
We review your current dispensing problems and automation goals.
Detail and Define
Fancort will work with you to create a detailed proposal.
PO to Deployment
Fancort will provide weekly meetings, status updates, onsite install, training and support plans.
Human or Robotic Dispensing?
Why Automate?
Productivity Gains
Improve Cycle Time.
High precision.
Reduced Rework.
Lack of labor.
Operational Improvements
Lower expenses.
Increase uptime.
Decrease material costs.
Reduce turnover / training.
Quality Improvements
Error-proofing.
Traceability.
Zero-defect requirements.
Fancort Signature
CAD Design Proposal.
Sampling Reports in video/pictures.
Engineering Study to determine the best match to your application.
Fancort™ Automated Robotic Dispensing Cell
Key Advantages
Automated Robotic Dispensing Cell: Key Advantages
Accuracy: Robots can dispense exact quantities of liquids or solids with high accuracy and precision, reducing the chances of errors and inconsistencies that can occur with manual dispensing.
Speed: Robotic dispensing is faster than manual dispensing, allowing for more efficient workflows and increased productivity.
Consistency: Robots can perform dispensing tasks consistently over time without becoming fatigued or making mistakes due to human error.
Safety: Robotic dispensing eliminates the need for human operators to handle hazardous or toxic materials, reducing the risk of exposure and improving workplace safety.
Flexibility: Robotic dispensing systems can be programmed to handle a wide range of materials and dispensing tasks, making them ideal for use in various industries and applications.
Overall: Robotic dispensing offers a reliable and efficient way to perform dispensing tasks with high accuracy, speed, and safety
System
System Specs.
Available Platforms: Inline, Twin table, Stand Alone
Available Work Area: 400x400, 600x600, 800x800, 1200x1200
Platform: Standalone/Cell/ Robotics.
o L x W x H = 42” x 42” x 72” (However this may change – TBD during design review).
Real-time monitoring.
Turn-key Solution.
Touchscreen for operating panel.
Custom Design.
Tower Light.
Available Options
01. Upgrade to a 6-axis robot
02. Gantry Robot
03. Twin table setup
04. Custom Fixture
05. Scanner for MES (Traceability) with FOS®
06. Fiducial Correction (Vision system)
07. Vision Inspection System
08. Pallet Lifting System
09. "Tool Center Point (TCP)" for nozzle
height control
10. Digital weight scale with I/O communication
for dispensing feedback
11. Return Conveyor Integrated
Fluids
Applications
Conformal coating
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Encapsulation & glob top
Applying an epoxy or silicone based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical stability during shock and vibration, as well as environmental protection from moisture and foreign objects.
Potting
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
Dam & fill
A 2-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead.
Underfill
The application of an (typically) epoxy based fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.
Bonding
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
Gasketing
Also known as “form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.
Optical bonding
The process of applying an optically clear liquid to a digital display, such as LCD or plasma, to bond a cover glass and/or touch sensor to eliminate the air gap between each layer. This provides improved image clarity, especially in outdoor or bright light environments, improved resistance to shock and vibration, and additional protection against dust and moisture.
Starting Price
Starting Price
$89,955 USD
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