PBT CLEANING EQUIPMENT

Trusted by the Aerospace & Defense Industry for over 47 years

 

Fancort offers a large product selection for board cleaning
Our high performance cleaning machines are designed to remove all unwanted contamination in electronic manufacturing
Removing post reflow resin and flux soldering residues eliminates eventual corrosion leading to dendrite formations, leakage currents and shorts

 

USA SUPPORTED

Shipped from USA

Thousands of Equipments Sold

Serving the industry since 1973

Perfect Cleaning

Fully automatic cleaning machine

Worldwide Shipping

We ship our equipments globally

SHOP OUR PBT CLEANING EQUIPMENT

Thorough cleaning with optimal wash process significantly improves surface insulation resistance (SIR) - it is a major factor for increasing reliability of electronics running in harsh environment

Cleaning of soldering pallets and jigs removes solder balls and solder splashes, improves the PCBA placement precision in the solder wave or selective solder machine reduces cross-contamination by flux and significantly prolongs the lifetime of pallets

CompaCLEAN


FEATURES

  • Fully automatic zero drain system
  • Ideal for cleaning middle to high volume of electronic assemblies
  • Suitable also for cleaning of soldering pallets and mechanical parts

APPLICATION

  • Defluxing, removing activators and resin residues
  • Cleaning contamination from handling and board manufacturing
  • Cleaning second side misprints on complex assemblies
  • Cleaning before conformal coating
  • Cleaning of soldering pallets
  • Fine degreasing of mechanical parts

MiniSWASH


FEATURES

  • Fully automatic zero drain system
  • Ideal for cleaning stencils, screens and misprints
  • Suitable for defluxing of small volume of PCBA with high quality requirements

APPLICATION

  • Removing solder paste from any type of stencils, screens and printer squeegees
  • Removing SMT Glue residues from any type of stencils, screens or PumpPrint stencils
  • Defluxing, removing activators and resin residues, cleaning contamination from handling and board manufacturing
  • Cleaning second side misprints on complex assemblies

SuperSWASH


FEATURES

  • Fully automatic high performance zero drain system
  • Ideal for cleaning middle to high volume of electronic assemblies
  • Suitable for cleaning high volume of stencils

APPLICATION

  • Defluxing, removing activators and resin residues
  • Cleaning contamination from handling and board manufacturing
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning of power electronics
  • Cleaning electronic assemblies requiring extra short process time
  • Cleaning second side misprints on complex assemblies
  • Cleaning before conformal coating
  • Cleaning before wire bonding

HyperSWASH


FEATURES

  • Fully automatic cleaning machine
  • Spray-in-air closed loop zero drain system
  • Multiple platform configuration
  • Superb for cleaning high volume of electronic assemblies

APPLICATION

  • Defluxing – removing all kinds of solder residues
  • Cleaning of micro mechanical components
  • Removing contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
  • Cleaning of power electronics
  • For electronic assemblies requiring extra short process time
  • Ideal for second side misprints on complex assemblies
  • Cleaning before conformal coating and wire bonding

UniCLEAN


FEATURES

  • Manual operated dip-tank cleaning system
  • Full process parameters control by PC
  • Ideal for cleaning of small volume of PCBA
  • Perfect for cleaning of micro-mechanical parts
  • Flexible configuration of cleaning technologies

APPLICATION

  • Defluxing, removing all kinds of solder residues
  • Cleaning of micro-mechanical components
  • Cleaning contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning before conformal coating
  • Cleaning before wire bonding
  • Cleaning by water based or semi-aqua cleaners

UniCLEAN XL


FEATURES

  • Fully automatic inline cleaning system
  • Ideal for cleaning high volume of electronic assemblies
  • Flexible configuration of cleaning technologies

APPLICATION

  • Defluxing, removing all kinds of solder residues
  • Cleaning of micro-mechanical components
  • Cleaning contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning of power electronics
  • Cleaning electronic assemblies requiring extra short process time
  • Cleaning before conformal coating
  • Cleaning before wire bonding
  • Cleaning by water based or semi-aqua cleaners

 

We can customize to fit your needs, for more information, click on the button or contact:

Nor Omar
nor@fancort.com
(888)-326-2678 x 706