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Electronics Production Specialist Since 1973

888-326-2678

HyperSWASH

PBT Works PCB Cleaning
Cleaning technology for higher reliability of electronics.

  • Our high performance cleaning machines are designed to remove all unwanted contamination present in electronic manufacturing and micro-mechanic processes.
  • Removing post reflow resin and flux soldering residues from PCBAs eliminates eventual corrosion leading to dendrite formations, leakage currents and shorts.
  • Defluxing is highly recommended for circuit boards populated by BGA, CSP, LGA, QFN, MELF and other low standoff components
  • Thorough cleaning with optimal wash process significantly improves surface insulation resistance (SIR) - it is a major factor for increasing reliability of electronics running in harsh environment
  • Removing residues before wire bonding and tape bonding, with proper surface passivation greatly improves bond adhesion, assures sufficient results on bond share tests
  • Cleaning before conformal coating assures low surface tension of electronic assemblies and greatly improves coating adhesion and eliminates potential of corrosion under protective layer
  • Automated SMT stencil cleaning reduces risk of mechanical damage of the stencil and is faster compared to traditional manual cleaning
  • Regular cleaning of condensation traps and filters from SMT ovens ensures their error-free heat transfer functionality
  • Cleaning of soldering pallets and jigs removes solder balls and solder splashes, improves the PCBA placement precision in the solder wave or selective solder machine reduces cross-contamination by flux and significantly prolongs the lifetime of pallets

Features:

  • Fully automatic cleaning machine
  • Spray-in-air closed loop zero drain system
  • Multiple platform configuration
  • Superb for cleaning high volume of electronic assemblies

Application:

  • Defluxing – removing all kinds of solder residues
  • Cleaning of micromechanical components
  • Removing contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
  • Cleaning of power electronics
  • For electronic assemblies requiring extra short process time
  • Ideal for second side misprints on complex assemblies
  • Cleaning before conformal coating and wire bonding

SuperSWASH

Features:

  • Fully automatic high performance zero drain system
  • Ideal for cleaning middle to high volume of electronic assemblies
  • Suitable for cleaning high volume of stencils

Application:

  • Defluxing, removing activators and resin residues
  • Cleaning contamination from handling and board manufacturing
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning of power electronics
  • Cleaning electronic assemblies requiring extra short process time
  • Cleaning second side misprints on complex assemblies
  • Cleaning before conformal coating
  • Cleaning before wire bonding

MiniSWASH

Features:

  • Fully automatic zero drain system
  • Ideal for cleaning stencils, screens and misprints
  • Suitable for defluxing of small volume of PCBA with high quality requirements

Application:

  • Removing solder paste from any type of stencils, screens and printer squeegees
  • Removing SMT Glue residues from any type of stencils, screens or PumpPrint stencils
  • Defluxing, removing activators and resin residues, cleaning contamination from handling and board manufacturing
  • Cleaning second side misprints on complex assemblies

CompaCLEAN

Features:

  • Fully automatic zero drain system
  • Ideal for cleaning middle to high volume of electronic assemblies
  • Suitable also for cleaning of soldering pallets and mechanical parts

Application:

  • Defluxing, removing activators and resin residues
  • Cleaning contamination from handling and board manufacturing
  • Cleaning second side misprints on complex assemblies
  • Cleaning before conformal coating
  • Cleaning of soldering pallets
  • Fine degreasing of mechanical parts

UniCLEAN

Features:

  • Manual operated dip-tank cleaning system
  • Full process parameters control by PC
  • Ideal for cleaning of small volume of PCBA
  • Perfect for cleaning of micromechanical parts
  • Flexible configuration of cleaning technologies

Application:

  • Defluxing, removing all kinds of solder residues
  • Cleaning of micromechanical components
  • Cleaning contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning before conformal coating
  • Cleaning before wire bonding
  • Cleaning by water based or semi-aqua cleaners

UniCLEAN XLarge

Features:

  • Fully automatic inline cleaning system
  • Ideal for cleaning high volume of electronic assemblies
  • Flexible configuration of cleaning technologiesFl

Application:

  • Defluxing, removing all kinds of solder residues
  • Cleaning of micromechanical components
  • Cleaning contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
  • Cleaning of power electronics
  • Cleaning electronic assemblies requiring extra short process time
  • Cleaning before conformal coating
  • Cleaning before wire bonding
  • Cleaning by water based or semi-aqua cleaners

For more information, contact:

Nor Omar
888-326-2678 x 706
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