Ultrasonic Soldering

Japan UNIX and Fancort have combined to offer ultrasonic soldering solutions to solder the unsoderable. The technology is available in manual soldering and robotic soldering systems and is designed to apply high-frequency vibrational energy to a molten filler metal to solder parts without flux. Ultrasonic soldering also creates strong attachments through mechanical and chemical means. The vibrational energy forces the liquid solder into tiny crevices and pores in the substrates which helps to seal the parts and greatly increase the surface area to which the solder can bond.

The chemical means uses a special solder which usually has trace amounts of aluminum, beryllium, indium, solicon, silver, titanium, zinc and rare earth elements. These have a strong affinity with oxygen and tend to form oxides that chemically bind to glass, ceramics and metals. This solder is available from Fancort in leaded or lead free composition.

Hand Held Ultrasonic Soldering Iron	Unisonik Graphic

Controller	Example of Ultrasonic Soldering on Glass

Manual Model Number: UNISONIK-M

Comes with controller #US-01, hand-held ultrasonic soldering iron, stand and one tip.

For integration into a robotic system, contact Fancort

Unisonik Brochure (PDF)