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Electronics Production Specialist Since 1973

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Technical and Spec Sheets

Coplanarity

High lead-end coplanarity in surface-mounted lead chip carriers is an important factor in reliable solder attachment to the printed board. Planarity may be measured from the lowest three leads of a leaded package. Coplanarity of 0.1 mm [0.004 in] maximum is recommended with 0.05 mm [0.002 in] preferred.

  • The difference between toe up and toe down is the position of the tip of the foot relative to the PCB. Generally toe down works better if you/they are going to hand solder with an iron. If you/they are going to solder and reflow in an oven toe up is more desirable. The reason being most of the solder strength is in the heel fillet and using the above process maximizes that..

For more information, contact:

Robert Antonelli
888-326-2678 x719
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