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Electronics Production Specialist Since 1973

888-326-2678

Component Processing Services


VIDEO OF AN FPGA ROBOTICALLY TINNED     COMPONENT PROCESSING SERVICES

Fancort is the industry leader in component lead preparation services for the Semiconductor and Aerospace industries. We have over thirty-nine years of experience in lead forming of a wide variety of packages, including large and small Flat Packs and Quad Packs, DIPs, fiberoptic headers and devices that require conversion from through-hole to SMT. We use our unique universal and dedicated tooling systems and complete process control to ensure accuracy and quick turnaround of your parts to JEDEC and/or mil-spec dimensions, with optional services such as leak testing and tinning if required.

 

Form and Trim Features:
  • Fancort Industries is ISO 9001:2008 Certified from 16-January-2013 until 16-January-2016. Certificate # US 13/82686.
  • Fancort Industries is "ITAR registered, code M22953, as of 15-May-2008". Fancort is, also, listed with the US Government under Cage Code # 6L 152. Fancort is an approved NASA supplier of Forming Services and Tools.
  • Lead forming to Mil-std-883K and NASA Std FP 51 3414 Rev. H Section 3and IPC J-STD-001E-2010 / April 2010
  • Complete process control and documentation.
  • Standard footprint layouts available, or we will design your custom footprint.
  • All work is done in a controlled ESD Safe environment. Our facility meets all requirements for Class Zero applications (0-250 volts).
  • DOD MIL-STD-1686C Compliant.
  • Turnaround can be as little as three days (typically 10 working days).
  • Inspection of incoming devices for lead skew or other deformity.
  • Inspection report and Certificate of Compliance.
  • CPS What We Offer & What We Don't

Tinning and Gold Removal Features:
  • Lead tinning is per IPC J-STD-001E-2010 & IPC J-STD-001ES-2010 (Requirements for Soldered Electrical & Electronic Assemblies).
  • Fancort is IPC J-STD-001ES CERTIFIED for tinning Space grade flat packs and quad packs as of 18-November-2013.
  • Tinning is done on our automated LTS200 machine.
  • Our tinning is done in a 100% inert, Nitrogen environment.
  • Solder used is 63/37 Ultra pure standard.
  • Fancort uses a non-flux process with an automated tinning machine, Nitrogen blanket and dual dynamic pot process
  • Video of an Actel 256 FPGA device formed by Fancort showing tinning in our Robotic 2-Step System
  • TO Can Tinned and Formed
  • "Flux", for Gold leaded parts, may be used upon customer special request.  Fancort's standard is: No Flux.
  • Flux is a cleaning process that is normally not needed for high reliability Gold parts.
  • Per J-STD-001E & -001ES. "For surface mounted parts, the gold shall be removed from at least 95% of the total gold plated surface to be soldered."
  • Fancort's solder pot testing complies with J STD 001E contamination limits. (Table 3-1 on page 7). 
  • Fancort standard Mil-spec process is a double dip procedure to remove the gold first, then add the second coating.
  • The normal Lead Tinning height is about 1/2 way up the leg, giving full heel coverage for excellent soldering to the PC Board.  In no case shall the solder line extend further than halfway up the shoulder bend.
  • Solder alloys used for solder dip are in accordance with J-STD-006, or equivalent, and shall contain a minimum of 3% lead. Hot solder dip meets the tinning requirements of ANSI/IPC J-STD-001E, Class 3, and tinned leads shall meet the solderability requirements of J-STD-002, Category 3.
  • Fine and Gross Leak Testing
  • Applicable Specifications & Standards:
    • IPC J-STD-001E, "Requirements for Soldered Electrical and Electronic Assemblies".
    • IPC J-STD-001ES "Space Applications Electronic Hardware Addendum to IPC J-STD-001E."
    • MIL-STD-1580 Physical Destructive Testing
    • MIL-PRF-38535, General Specification for Integrated Circuits Manufacturing
    • MIL-PRF-38534, General Specification for Hybrid Microcircuits
    • MIL-PRF-19500, General Specification for Semiconductor Devices
    • NASA STD 8739.3 with Change #4
    • Mil specs "QQ-S-571F"   

Fancort's Conflict Free Metal Policy 2014

Photos of Product and Inspection Departments

Request the New Fancort ISO Style Quality Control Manual

Standard SMT Footprints

Technical and Specification Sheets


"Dummy Parts for SetUp" Quads
"Dummy Parts for SetUp" FlatPack




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 For more information, contact:
Lee Boki
888-326-2678 x 722

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