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Electronics Production Specialist Since 1973

888-326-2678

New ACF Hot Bar Bonder for Fine Pitch Assemblies

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This new bonder tacks the conductive adhesive to the pads of the PCB instead of using solder on the pads. Then the flex is positioned over the pads and the bonding process continues with the thermode that is programmed to a specific temperature, time and pressure to bond the flex to the rigid assembly.


For more information, contact:

Steve Hoover
888-326-2678 x723
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